STI’s Prototype and Development Laboratory's fast, flexible, and very precise surface mount assembly line complement the hand assembly line and allow for expeditious and defect-free production of new and redesigned electronics hardware. Services not only include small to mid volume production, but also component procurement, assembly profile establishment, and manufacturability analysis as well.

Twin Pick & Place Machines offer high speed, accurate component placement

Utilizing some of the most advanced placement equipment available today, a large range of component sizes and types can be quickly and accurately placed. Whether placing an 0201 chip component or a 598 BGA device, laser component centering along with automated visual alignment/verification ensures that the placement is accurate and correct. Utilizing all-ball recognition technology and multi-imaging vision capability offers optimum handling of both BGA’s as well as µBGA’s.

Surface Mount Assembly Line

State of the art reflow equipment provides 25% higher airflow for enhanced temperature uniformity, repeatability and high-load handling. The reflow oven features new, enlarged heating tunnel and baffle-free design, for six-sigma consistency, zone-to-zone. Rapid response times and precise temperature capability assure process uniformity, regardless of component density or board loading, with identical profile performance in either air or nitrogen.

Complementing the automated assembly line is the equally capable hand assembly line, which produces high reliability hardware for numerous space, defense, and commercial applications. Whether your application is consumer electronics or mission critical flight hardware, Soldering Technology International is your total solutions partner.

For more information, please contact us.