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Dummy Components
Surface Mount

Click on a link below to view detailed information for the surface mount dummy component
  • BQFP – Bumpered Quad Flat Pack
  • CABGA – Chip Array Ball Grid Array
  • CBGA - Ceramic Ball Grid Array
  • CERAMIC CAPACITORS
  • CHIP RESISTORS
  • D PAK/DD PAK – Surface Mount Transistor
  • FLEX BGA/TABGA – Tape Array Ball Grid Array
  • LQFP – Low Profile Quad Flat Pack (1.4 mm thick body)
  • MELF DIODE / SOD 80 – Small Outline Diode
  • MELF RESISTORS – Metal Electrode Face (Cylindrical)
  • PBGA/BGA – Plastic Ball Grid Array
  • PLCC – Plastic Leaded Chip Carrier
  • QFP – Quad Flat Pack
  • SBGA® - Super Ball Grid Array
  • SOIC – Small Outline Integrated Circuit
  • SOJ – Small Outline J Bend
  • SOLIC – Small Outline Integrated Circuit (L designates wide body)
  • SOT – Small Outline Transistor
  • SSOP – Shrink Small Outline Package (3.9 mm, 5.3 mm, 7.5 mm wide body)
  • TANTALUM CAPACITORS
  • Through Hole Parts
  • TQFP – Thin Quad Flat Pack (1.0 mm thick body)
  • TSOP Type 1 – Thin Small Outline Package
  • TSOP Type 2 – Thin Small Outline Package
  • TSSOP – Thin Shrink Small Outline Package (4.4 mm, 6.1 mm wide body)
  • uBGA® - Micro Ball Grid Array
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